Die & Wafer

The World’s Largest Franchised Offering of Wafer, Die & Value Added Services

  • Die & Wafer Distribution
  • Thinning, Saw, Sort, Inspect
  • Wafer Bumping
  • Long Term Die/Wafer Storage
  • EOL Die Sustainment (EDSP)
More Info

Micross Components is the exclusive provider of die from Avalanche’s Gen 3 family. With industry leading density, endurance, reliability and power, the 1Gb die can be leveraged in custom 3DHI & SiP implementations.

Micross also offers 2.5 and 3D Heterogeneous Integration, along with System In Package and many other services.

3450 West Warren Avenue, Fremont, CA 94538
(510) 897-3300
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