Avalanche Technology Shipping High Density Bootable MRAM Solutions for FPGAs in Space

Unified Memory Support Enables Space-Based Processing Architectures to Mirror Design Simplicity of Terrestrial Systems

Fremont, CA, January 9, 2023 – Avalanche Technology, the leader in next generation MRAM technology announced today the immediate availability of much anticipated Gen 3 Space Grade Dual QSPI solutions, now shipping in pre-production. Based on Avalanche’s latest generation of Spin Transfer Torque Magnetoresistive RAM (STT-MRAM) technology, this third-generation product family offers significant density, endurance, reliability, and power benefits over existing memory solutions for aerospace and defense applications, particularly for easily configuring advanced SoCs and FPGAs, which are known to present complex design challenges.

As processing requirements rapidly increase through infrastructure modernization of defense and satellite systems, challenges associated with lagging environment-appropriate memory technologies have handicapped realizable advancement of these systems. This dynamic is heightened when configuring and supporting advanced SoCs and FPGAs for these environments such as AMD (Xilinx) Versal and UltraScale+ ACAP platforms, now approved for use in space and being widely adopted by this community for AI acceleration. Platforms like these would have historically relied on cumbersome memory subsystem partitioning using a combination of PROMs, NOR Flash and SRAM, each with its own required radiation mitigation schemes, resulting in bloated, complex, and expensive designs that extend design and qualification time.

Hailed by the community as the “silver bullet” for this “boot module” application, the Avalanche Gen 3 Space Grade Dual QSPI device family enables consolidation of historically complex partitioning to that of a singular device(s), capable of reliably configuring advanced FPGAs and SoCs with large image sizes and real time operating systems (RTOS) while also providing support as working memory. Layered onto the core differentiation of Avalanche’s Gen 3 Space Grade P-SRAM™ (Persistent SRAM) family including benchmark environmental resilience, density, endurance, power, performance, and high reliability, the Dual QSPI products offer additional tailored features to accelerate design and in situ configuration of these advanced processing platforms for maximized system performance.

“With this new product family release, we are providing solutions to long-standing challenges faced by the Hi-Rel community at an unfamiliar pace of innovation”, said Danny Sabour, Vice President of Marketing and Business Development at Avalanche Technology. “By adding tailored interfacing and write protection schemes to a product platform that can consolidate traditional non-volatile and volatile memory functions alike, this Gen 3 Dual QSPI family offers pin compatible scalability of density and orbital classification, yielding system platforms that are SWaP optimized and versatile.”

Working in concert with industry experts, including resources from AMD (Xilinx) to ensure robustness of the platform solution, Avalanche has rolled out key design enablement deliverables in recent weeks to accelerate evaluation, design, and prototyping of a SWaP optimized system implementation. These design support resources include reference designs, models, a quick start guide for booting an AMD (Xilinx) Versal FPGA/ACAP and two evaluation board options offered through distribution partner, Falcon Electronics, including a plug in card that connects directly to existing VCK190 development kits via its existing Samtec connector.

Avalanche Gen 3 Space Grade Serial Dual QSPI Persistent SRAM 

The Gen 3 Space Grade Dual QSPI series is offered as a standard product in density options from 1Gb to 8Gb and has a serial bus interface with byte addressability with no wear leveling. Designed for High Reliability with multibit error correction and industry leading 1016 write cycle endurance, data is always non-volatile. The devices are offered in compact 96-ball FBGA (20mm x 20mm) packages with the extended (-40°C to 125°C) operating temperature range and a JEDEC qualification flow, where every device goes through a 48-hour burn in before being shipped to customers. There are additional qualification screening options available through partners. More information about Avalanche P-SRAM products is available at https://www.avalanche-technology.com/products/discrete-mram/space/.

About Avalanche Technology

 Avalanche Technology Inc. is the leader in next generation Perpendicular STT-MRAM technology, accepted as the front-runner to replace traditional Flash and SRAM for unified memory architectures in future SOC systems, delivering high performance and low power at 55, 40, 28 and 22nm with scalability beyond 14nm. With a proven STT-MRAM portfolio at multiple geometry nodes combined with an intellectual property portfolio of over 300 patents and applications, Avalanche Technology is delivering on the promise of enabling the next generation of scalable unified memory architecture for industrial, IoT, aerospace and storage applications, making it the true “Next Generation MRAM Company.” For more information, visit us online at https://www.avalanche-technology.com.

View on PR Web: https://www.prweb.com/releases/2023/1/prweb19102977

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